| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of improving yields of a solid-state imaging apparatus. <P>SOLUTION: In a camera module having a CMOS image sensor, a semiconductor chip 2A for an optical sensor is mounted on an optical system part mounting surface of a wiring board base 1 and after bonding wire connection, a lens barrel 4 is joined to the wiring board base 1 so as to cover the semiconductor chip 2A. For the positional alignment between the lens barrel 4 and the wiring board base 1, a positioning pin 4C1 provided in the lens barrel 4 and a through-hole 16 provided on the wiring board base 1 and into which the positioning pin 4C1 is inserted are provided outside the joined surface between the lens barrel 4 and the wiring board base 1. <P>COPYRIGHT: (C)2009,JPO&INPIT |
