PRESSURE-SENSITIVE ADHESIVE TAPE FOR ELECTRONIC COMPONENT FABRICATION

摘要

Disclosed is a pressure-sensitive adhesive tape for electronic component fabrication that has a very high level of antistatic properties, can realize excellent adhesion between an antistatic layer and a pressure-sensitive adhesive layer, does not attack a magnetic head formed of a metal, such as pure copper, or alumina, and can easily be removed. The pressure-sensitive adhesive tape comprises a base material film (3) and a pressure-sensitive adhesive layer (7). An antistatic layer (5) of an electroconductive polymer is provided on one side or both sides of the base material film (3). The pressure-sensitive adhesive layer (7) is of a radiation curable type, is composed mainly of an acrylic copolymer containing each of at least a radiation curable carbon-carbon double bond-containing group, a hydroxyl group, and a carboxyl-containing group attached to a main chain thereof, and has a gel fraction of not less than 60%.