| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-dissipating structure of a ceramic circuit substrate preventing module performance from being influenced by solder cracks when making a ceramic circuit substrate having an LED element thinner and forming a module of the ceramic circuit substrate and a heat-dissipating member by joining them with lead-free solder. <P>SOLUTION: The ceramic circuit substrate 1 has a junction pattern 5 on a surface opposite to a surface on which an LED element 4 is mounted. The junction pattern 5 and part of a heat-dissipating substrate 6 are solder-joined with a solder layer 16 to form a main junction 17. A dummy pattern 12 is formed on a part other than the main junction 17 of the junction pattern 5 and the heat-dissipating substrate 6 via an insulating layer 11 having no solder-wettability to form a dummy junction 18 by solder-joining the dummy patter 12 by means of the solder layer 16. A clearance region 15 independent of solder junctions is provided between the main junction 17 and the dummy junction 18. <P>COPYRIGHT: (C)2009,JPO&INPIT |
