发明名称 LOW CHLORINE EPOXY RESIN FORMULATIONS
摘要 <p>This invention relates to the need to improve the corrosion resistance of very low total chlorine epoxy resins which contain very low contents of organically bound chlorine. The invention relates to the improvement of corrosion resistance of such epoxy resins for electronic applications by the addition of specific additives acceptable to the electronics industry. The use of these low chlorine resins in combination with said additives has been shown to be corrosion-free on highly corrosive surfaces such as aluminum and copper, which are frequently encountered in electronic applications.</p>
申请公布号 WO2009114164(A1) 申请公布日期 2009.09.17
申请号 WO2009US01575 申请日期 2009.03.11
申请人 MICROCHEM CORP.;JOHNSON, DONALD, W.;WEN, DAI 发明人 JOHNSON, DONALD, W.;WEN, DAI
分类号 G03C1/00;G03F7/00;H01L21/00 主分类号 G03C1/00
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