| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a package substrate, which improves bonding reliability between a chip bump in a semiconductor chip and a solder bump in the package substrate, and to provide a method of manufacturing a semiconductor package. <P>SOLUTION: The method of manufacturing the package substrate on which the semiconductor chip having the chip bump formed thereon is mounted includes: a step (S100) of providing a circuit board where an electrode pad is formed; a step (S200) of forming the solder bump on the electrode pad; a step (S300) of hot-pressing a tool onto the substrate, so that a protrusion or recess provided in the tool faces the solder bump, wherein the tool includes the protrusion and recess formed thereon corresponding to the shape of a chip bump; and a step of releasing the tool. <P>COPYRIGHT: (C)2009,JPO&INPIT |
