| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent poor adhesion between a bonding pad for a semiconductor chip and a wire in a wire bonding process. <P>SOLUTION: In a wire bonding method, Au balls 9a are connected sequentially to two mutually adjacent bonding pads 8a and 8b, and the heights (A1 and A2) of a capillary 38 at each first bonding are compared. When a difference (¾A1-A2¾) of the two heights exceeds a threshold because of a contamination 14 on the surface of the bonding pad 8b, a bonding work is stopped instantaneously. Accordingly, poor adhesion of the Au balls 9a to the bonding pad 8b can be detected reliably in a moment. <P>COPYRIGHT: (C)2009,JPO&INPIT |
