| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which has a heat generating component mounted on one surface of a substrate with an adhesive containing a number of heat conductive fillers in a resin and allows efficient heat dissipation by making it easy to form a heat by thermally connecting heat conductive fillers in a direction from the heat generating component to the substrate. <P>SOLUTION: In the resin 31 of the adhesive 30, a filmy connection member 40 is provided which is larger than the heat conductive fillers 32 and is formed of a heat conductive material and whose section is formed in a wave shape, and the connection member 40 has a wall surface 41 extending in the direction X from the heat generating component 20 to the substrate 10 among the plurality of heat conductive fillers 32. <P>COPYRIGHT: (C)2009,JPO&INPIT |
