发明名称 LED PACKAGE
摘要 <P>PROBLEM TO BE SOLVED: To improve the uniformity of intensity distribution in the luminescent surface by reducing the unevenness of intensity in an LED package (the luminescent surface thereof). <P>SOLUTION: In the LED package equipped with a package body with a recess of bottomed polygonal and conical configuration, an LED light-emitting element arranged in the recess and a transparent sealing material filled into the recess, a dispersion layer is formed on the surface of the transparent sealing material filled into the recess. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009212287(A) 申请公布日期 2009.09.17
申请号 JP20080053387 申请日期 2008.03.04
申请人 STANLEY ELECTRIC CO LTD 发明人 HIRASAWA HIROSHI;SUZUKI NAOTO;EBITANI TAKASHI
分类号 H01L33/48;H01L33/52;H01L33/54;H01L33/56;H01L33/60 主分类号 H01L33/48
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