发明名称 ROTATION APPLYING METHOD AND ROTATION APPLYING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a rotation applying method for forming a coated film in a wider range while reducing a dropping amount of coating liquid. <P>SOLUTION: The rotation applying apparatus 100 is configured so as to drop the coating liquid onto a center part of a substrate by a first dropping amount with a coating liquid supplying part while rotating the substrate around the center part of the substrate with a first rotation number by the use of a rotating driving source, after dropping the coating liquid by the first dropping amount, drop the coating liquid onto the center part of the substrate by a second dropping amount with the coating liquid supplying part while rotating the substrate with a second rotation number smaller than the first rotation number by the use of the rotating drive source and, after dropping the coating liquid by the second dropping amount, rotate the substrate with a third rotation number for determining a film thickness of the coating liquid by the use of the rotating drive source. Therein, the first rotation number is such a rotation number that the coating liquid of the first dropping amount does not spread uniformly over the substrate owing to air resistance. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009207997(A) 申请公布日期 2009.09.17
申请号 JP20080053404 申请日期 2008.03.04
申请人 TOSHIBA CORP 发明人 NAKAZAWA KEISUKE
分类号 B05D1/40;B05C11/08;G03F7/16;H01L21/027;H01L21/31;H01L21/312 主分类号 B05D1/40
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