| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit apparatus capable of suppressing a temperature rise without reducing the efficiency of the circuit apparatus when semiconductor elements are arranged, fixed and wired mutually on a heat-dissipating surface of a radiator. <P>SOLUTION: A semiconductor element 2 is equipped with a lead terminal 4 led out from the inside of the body and an exposed electrode 201. A conductive and heat-dissipating plate 1 is equipped with a heat-dissipating portion 6 exposed to and cooled by a refrigerant and a conductive portion mounting the electrode 201 of the semiconductor element 2. An insulating frame portion 10a holds a plurality of conductive and heat-dissipating plates 1 mounting the semiconductor element 2 at prescribed intervals. A circuit portion forms a prescribed circuit by connecting lead terminals 4 and connection terminals of electrodes 201 formed on the conductive portion. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
