| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency package having differential transmission lines capable of reducing interferences with surrounding wires and influences by noises and easily matching to an appropriate characteristic impedance. SOLUTION: The high frequency package includes a multi-layer substrate having electronic components on it, a pair of electrode pads 20 formed on the surface of the multi-layer substrate, a pair of BGA pads 27 for external connection formed on the back of the multi-layer substrate, and differential transmission lines to transfer high frequency differential signals between the electrode pad 20 and the BGA pad 27. The differential transmission line is composed of a pair of signal lines 24 formed on a dielectric layer of the multi-layer substrate, a ground structure formed around the signal lines 24, a pair of first signal via-holes 21 connecting the electrode pad 20 to one side of the signal lines 24, a plurality of first ground via-holes 23 disposed around them, a pair of second signal via-holes 26 connecting the other end of the signal lines 24 to the BGA pad 27, and a plurality of second ground via-holes 29 disposed around them. COPYRIGHT: (C)2009,JPO&INPIT
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