VARIABLE CAPACITANCE ELEMENT

摘要

Insulating first and second substrates (1, 2) having through-holes (3, 4) in which copper (13, 14) is filled are disposed so that the respective substrate surfaces face each other with a space in-between. A fixed electrode (5) conducted to the copper (13) is formed on the facing substrate surface (11) of the first substrate (1). An insulating stopper (10) is provided on the surface of the fixed electrode (5). A movable electrode (7) conducted through a beam portion (6) to the copper (14) is formed on the facing substrate surface (12) of the second substrate (2). The movable electrode (7) is spring-biased by the beam portion (6) toward the fixed electrode (5) and is floated from the second substrate (2). When a voltage is not applied to a driving electrode (9), the distance between the fixed electrode (5) and the movable electrode (7) narrows. When the voltage is applied, the movable electrode (7) moves toward the second substrate (2), widening the distance between the fixed electrode (5) and the movable electrode (7). This distance change causes the change of capacitance. A signal conduction path passing through this capacitance portion is formed by the path passing the copper (13, 14).