| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an inexpensive multilayer wiring board that achieves a multilayer wiring board having an interlayer connection via (bump) diameter and wiring width of not larger than 100μm while using a thick-film process having low manufacturing cost for forming a conductive bump, can keep the value of connection resistance between the conductive bump and a wiring pattern low in lamination, and has an improved yield, and to provide a manufacturing method of the multilayer wiring board. <P>SOLUTION: The multilayer wiring board 500 is composed by laminating a core wiring board 200 that has a conductive bump 51 in an insulating layer 61 and at least a layer of an insulation layer, and allows a wiring pattern 71 to be formed on the surface, and members 300, 400 for multilayer wiring boards where a conductive bump 2 and an insulating film 33 are formed on Cu foil 81 and the bottom surface diameter of the conductive bump 2 is smaller than that of the conductive bump 51. In the multilayer connection board, the conductive bump 2 of the members 300, 400 for multilayer wiring are electrically joined to the wiring pattern 71 in the core wiring board 200, and the insulating film 33 does not contain any fiber bases materials. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
