发明名称 MANUFACTURING METHOD FOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for a light-emitting device, capable of firmly jointing a substrate where organic EL elements are prepared and an electrode at high dimensional accuracy while reducing thermal damage on each organic layer constituting an organic EL element and a driving circuit, a light-emitting device manufactured by a manufacturing method for a light-emitting device and which is superior in characteristics, and to provide high-reliability electronic equipment. SOLUTION: The manufacturing method for a light-emitting device comprises: a process of forming barrier ribs 31, by drying up after supplying a fluid material containing a silicone material on a substrate 20 with a plurality of positive electrodes 3 provided so as to partition each positive electrode 3; a process of forming a hole transport layer 4 and a light-emitting layer 5 on each positive electrode 3 partitioned by the barrier ribs 31; and a process of making an adhesive property appear in the vicinity of the surface of the barrier ribs 31, by giving energy to at least a part of a range of the barrier ribs 31 and connecting the barrier ribs 31 and a negative electrode 6, arranged on the substrate 9 by means of the adhesive property appearing on the barrier ribs 31. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009212012(A) 申请公布日期 2009.09.17
申请号 JP20080055521 申请日期 2008.03.05
申请人 SEIKO EPSON CORP 发明人 GOMI KAZUHIRO
分类号 H05B33/10;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H05B33/12;H05B33/22;H05B33/26 主分类号 H05B33/10
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