发明名称 |
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP |
摘要 |
<p>A semiconductor die package. The semiconductor die package includes a leadframe structure, a first semiconductor die comprising a first surface attached to a first side of the leadframe structure, and a second semiconductor die attached to a second side of the leadframe structure. The second semiconductor die comprises an integrated circuit die. A housing material is formed over at least a portion of the leadframe structure, the first semiconductor die, and the second semiconductor die. An exterior surface of the molding material is substantially coplanar with the first surface of the semiconductor die.</p> |
申请公布号 |
WO2009114392(A2) |
申请公布日期 |
2009.09.17 |
申请号 |
WO2009US36226 |
申请日期 |
2009.03.05 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION;LIU, YONG;JU, JEFF;YUAN, ZHONGFA;LUO, ROGER |
发明人 |
LIU, YONG;JU, JEFF;YUAN, ZHONGFA;LUO, ROGER |
分类号 |
H01L23/48;H01L23/49;H01L23/62 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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