METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT

摘要

A method of reducing wire bond loop heights in wire bonds electrically connecting an integrated circuit die (4) with a contact pad (10) to a printed circuit board with a conductor (12), by mounting the integrated circuit die (4) such that the contact pad (10) is spaced from the conductor (12), positioning an adhesive surface (62) between the contact pad (10) and the conductor (12) on the printed circuit board, attaching wire (16) to one of the contact pad (10) and the conductor (12), drawing the wire (16) towards the other of the contact pad (10) and the conductor (1-2), allowing the wire (16) to contact the adhesive surface (62), and attaching the wire (16) to other of the contact pad (10) and the conductor (12) to form a wire bond adhered to the adhesive face.