| 摘要 |
A stacked semiconductor package is provided to additionally connect a stacked semiconductor package by reducing volume of a semiconductor package. Bonding pads are arranged on a top surface(110) of a substrate(100). Ball lands are arranged on a bottom surface(120), and are electrically connected to the bonding pads(130). Connection members(300) are electrically connected to a second end part which is faced with a first end part of each through electrode. A molding member(400) covers the substrate and the semiconductor chip, and exposes each connection member. Each connection member includes a conductive pattern part and a pad part. The conductive pattern part is bonded with each through electrode. The pad part is connected to the conductive pattern. The molding member exposes the pad part. The connection member is one among a solder layer, a gold plating layer, and a nickel/gold plating layer.
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