发明名称 SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To ensure flowability in an adhesive provided between a long resin projection and wiring in structure where the wiring is formed on the long resin projection. <P>SOLUTION: The resin projection 18 is long, where a section orthogonally crossing an axis along an extension direction is formed in a bow shape, and a bow-shaped chord is arranged in an insulation film 16. In a direction along the axis of the resin projection 18, the width of a surface W<SB>1</SB>opposite to wiring 20 in a lead 26 is narrower than width W<SB>2</SB>of a surface opposite to the lead 26 in the wiring 20. The wiring 20 includes a contact section 32 to the lead 26, and a noncontact section 34 to the lead 26 adjacent to the contact section 32. The resin projection 18 includes a shape for preventing stages from being formed on a surface 36 opposite to the contact section 32 and a surface 38 opposite to the noncontact section 34. In the resin projection 18, clearance is formed between a surface 40 opposite to the base substrate 24 except surfaces 36, 38 opposite to the wiring 20, and the base substrate 24. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009212203(A) 申请公布日期 2009.09.17
申请号 JP20080051966 申请日期 2008.03.03
申请人 SEIKO EPSON CORP 发明人 SATO NAOYA;NARITA AKIHITO
分类号 H01L21/60 主分类号 H01L21/60
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