| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent migration. <P>SOLUTION: A semiconductor module has a long elastic projection 18 disposed on an insulating film 16, wiring lines 20 extending across an axis AX along a direction wherein the elastic projection 18 extends to reach a top of the elastic projection 18, leads 26 coming into contact with parts of the wiring lines 20 on the elastic projection 18, a base substrate 24 where the leads 26 are formed, and a cured adhesive 22 holding an interval between the surface of a semiconductor chip 10 where the elastic projection 18 is formed and the surface of the base substrate 24 where the leads 26 are formed. The elastic projection 18 has hollows 28 formed by elastic deformation. Contact parts between the wiring lines 20 and leads 26 are disposed in the hollows 28. The elastic projection 18 has a part to come into contact with the base substrate 24 with elastic force between adjacent hollows 28. Part of the adhesive 22 is charged between an internal surface of a hollow 28 and a lead 26. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
