| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device that securely removes foreign matters soaking into a brush. SOLUTION: The substrate treatment device includes the sponge brush 18 for cleaning a wafer and a moving means of moving the sponge brush 18 between a predetermined treatment position and a predetermined standby position. The sponge brush 18 is stored in a standby pod 25 at the predetermined standby position. The moving means is controlled to alternatively perform a compressing operation to compress the sponge brush 18 by pressing the sponge brush 18 against a reception portion 43 in a state wherein the sponge brush 18 is supplied with a cleaning liquid in the standby pod 25, and an expanding operation to expand the sponge brush 18 for restoration with its own restoring force by making the sponge brush 18 leave the reception portion 43. COPYRIGHT: (C)2009,JPO&INPIT
|
