| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress the capital investment of a photolithography step by simultaneously using a reduction projection aligner and a nano imprint device to reduce the cost price of a semiconductor device. <P>SOLUTION: The nano imprint device is used to form a first pattern, and the reduction projection aligner is used to form a pattern in a subsequent step. This method allows distortion between shots to be reduced. The nano imprint device is also used to form a final protective film aperture and a bump electrode mask, thereby reducing the number of the reduction projection aligners so as to reduce the cost price of the semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT |
