发明名称 ADHESIVE FORMULATIONS FOR BONDING COMPOSITE MATERIALS
摘要 Adhesive formulations generally including an acrylate and/or methacrylate monomer; a vinyl ester resin having a weight average molecular weight ranging from about 450 to about 3000; and a catalyst. Also disclosed is a method for forming a composite material employing the formulations.
申请公布号 US2009229747(A1) 申请公布日期 2009.09.17
申请号 US20080046844 申请日期 2008.03.12
申请人 GENERAL ELECTRIC COMPANY 发明人 OLSON DANIEL ROBERT;LIN WENDY;SEEGER GEORGE THOMAS
分类号 C08F4/72;B32B27/00;C08F20/10;C09J5/00 主分类号 C08F4/72
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