EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

Provided is an epoxy resin composition for encapsulating a semiconductor device. The epoxy resin composition includes one or more epoxy resins, one or more curing agents, a curing accelerator and one or more inorganic fillers. A content of prismatic cristobalite as one of the inorganic fillers is in the range of 1 to 50% by weight, based on the total weight of the epoxy resin composition. The epoxy resin composition is capable of alleviating or reducing warpage of a semiconductor device having an asymmetric one-sided encapsulation structure while simultaneously providing excellent workability, flame retardancy, moldability and reliability.