FABRICATION METHOD OF LIGHT EMITTING DIODE PACKAGE

摘要

An LED package production method for preventing the deformation of a led chip or the wire bonding by the pressure and heat are provided to reduce the inferiority rate of the manufactured LED package by removing the injection amount deviation of the molding resin in a molding unit. A plurality of LED chips is separated on a base substrate(S210). A molding cap is adhered on the base substrate to cover the LED chip altogether(S220). The molding cap comprises a plurality of protrusions protruding and fitting to a mounting interval of the LED chip and a connection part connecting the protrusions is formed. The molding resin is injected through an inlet port to fill an internal space formed between the base substrate and the molding cap(S230). The molding resin filled with the internal space is hardened(S240).