| 摘要 |
PROBLEM TO BE SOLVED: To provide a normal-temperature bonding device capable of uniformly applying a large load to a bonding surface, bonding at low cost and a normal-temperature and increasing an production volume of product per unit time. SOLUTION: The normal-temperature bonding device is provided with: a first driving device for driving a first substrate 76 in a first direction; a second drive device for driving a second sample table 46 for holding a second substrate 77 in a second direction; a carriage supporting table 45 for supporting the second sample table 46 in the first direction when the second substrate 77 is pressure bonded to the first substrate 76; and a camera 73 for picking up images of alignment marks 78, 79 patterned on the first substrate 76 or the second substrate 77. An observation window 74 for transmitting light for picking up an image thereof is formed on the carriage supporting table 45. When the first substrate 76 is pressure bonded to the second substrate 77, such the normal-temperature bonding device can apply a larger load exceeding a load resistance of the second drive device to the first substrate 76 and the second substrate 77, and can align the first substrate 76 and the second substrate 77 based on its image. COPYRIGHT: (C)2009,JPO&INPIT
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