| 摘要 |
A recess is formed in a substrate. A bare chip, i.e., a light-emitting diode, is installed in the recess and connected to conductive members on the substrate with leads. A light-guiding layer composed of a light-guiding elastomer is disposed on the surface of the substrate. A light-guiding cover layer is bonded on the surface, and the bare chip and the leads are embedded in the elastomer. Light emitted from the bare chip passes through the light-guiding elastomer and is guided along the surface of the substrate to an illumination portion. Since the bare chip and the leads are embedded in the elastomer, failures such as disconnections of the leads under application of external force are suppressed.
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