| 摘要 |
An object to be irradiated with ultraviolet is a semiconductor wafer (W) whereupon a protection sheet (S) is attached through an ultraviolet curing adhesive layer (18). An ultraviolet irradiation section (12), which has a plurality of ultraviolet light emitting diodes (21) on a substrate (20), is arranged at a position facing the wafer. The light emitting diodes (21) are arranged at substantially the same intervals along a direction that substantially orthogonally intersects with a relative shift direction to the wafer (W). While the light emitting diodes (21) on each low have substantially the same peak wavelength, the peak wavelengths of the adjacent light emitting diodes (21) are not necessarily the same.
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