| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure for electronic components that facilitates the multi-pin configuration and assures the low-profile size. SOLUTION: As a mounting structure 10 for electronic components, an LSI chip (electronic component) 2, on which a first wiring layer 1A and a second wiring layer 1B are formed to be taken out from the front face side to the side face, is disposed at a via hole 3 on a substrate 6 where the via hole 3 is formed at almost a central portion and a first conductor layer 5A and a second conductor layer 5B corresponding to the first wiring layer 1A and the second wiring layer 1B respectively are formed at an inner wall face 4 of the via hole 3. The first wiring layer 1A and the first conductor layer 5A are connected via a solder (wax material) 7A, while the second wiring layer 1B and the second conductor layer 5B are connected via a solder 7B. COPYRIGHT: (C)2009,JPO&INPIT |
