发明名称 ELECTRONIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic circuit device capable of preventing a liquid resin as a sealing member from leaking from a contact part between a case body for storing an electronic circuit part and a cover member and dripping onto the outer surface of the case body. SOLUTION: A catching groove 34 is formed on the outer surface of the cover 30, which is extended upward from the outer side end part 502 of the contact part 50 between a case 20 and the cover 30, guides the liquid resin 41 upward which passes the contact part 50 and leaks outward, and catches the resin. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009212306(A) 申请公布日期 2009.09.17
申请号 JP20080053895 申请日期 2008.03.04
申请人 DENSO CORP 发明人 NAKAMURA TADASHI;TSUZUKI TAKEO
分类号 H01L23/02;H01L23/28 主分类号 H01L23/02
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