| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus that can precisely and easily perform alignment adjustment of the bonding surfaces of objects to be bonded or a stage on which objects to be bonded are held, thereby enabling excellent bonding. SOLUTION: Fine alignment adjustment of a stage part 15 is carried out by detecting a load applied on the stage part 15 by loadcells 35a, 35b, 35c and moving a X-Y stage mechanism 11 by a X-Y table control section 52 so as to make a load balance detected uniform, while an alignment reference surface of a reference body 45 is abutted and pressed to a predetermined position including the center of curvature P of a spherical base part 25 of the stage part 15 by a pressing means 2. COPYRIGHT: (C)2009,JPO&INPIT |
