| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of an electronic component that improves reliability of connection with a connection electrode. SOLUTION: The electronic component 1 to be connected to connection electrodes 33 and 34 is mounted on a substrate 31 having the connection electrodes 33 and 34. The electronic component has a function piece 11 having a predetermined function, a first core portion 24 formed on one surface of the function piece and having elasticity, conductive films 25 and 26 formed on an upper surface of the first core portion, and a holding portion 15 holding a state of electric contact between the conductive films and the connection electrodes. A second core portion 74 having elasticity is disposed on the other surface side of the function piece. The first core portion and the conductive films form a bump electrode, and the first core portion elastically deforms to bring the conductive films and the connection electrodes into electric contact with each other. COPYRIGHT: (C)2009,JPO&INPIT
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