Underfill Air Vent for Flipchip BGA

摘要

The invention relates to a system for assembling a flip chip assembly. An underfill resin is dispensed at multiple semiconductor die edges such that vacuum suction provided at a substrate through hole located beneath a stage enables spread of underfill resin from each edge simultaneously for quicker spread and reduction of voids. The excess underfill resin suctioned through the through hole on the underside of the semiconductor die is attracted to reusable tape. The attracted underfill resin is cleaned from a rotating head mechanism by a cleaning pad positioned beneath a lower surface of the head.