发明名称 Hybrid Process for Forming Metal Gates of MOS Devices
摘要 A semiconductor structure includes a first MOS device including a first gate, and a second MOS device including a second gate. The first gate includes a first high-k dielectric over a semiconductor substrate; a second high-k dielectric over the first high-k dielectric; a first metal layer over the second high-k dielectric, wherein the first metal layer dominates a work-function of the first MOS device; and a second metal layer over the first metal layer. The second gate includes a third high-k dielectric over the semiconductor substrate, wherein the first and the third high-k dielectrics are formed of same materials, and have substantially a same thickness; a third metal layer over the third high-k dielectric, wherein the third metal layer and the second metal layer are formed of same materials, and have substantially a same thickness; and a fourth metal layer over the third metal layer.
申请公布号 US2009230479(A1) 申请公布日期 2009.09.17
申请号 US20080047113 申请日期 2008.03.12
申请人 HSU PENG-FU;HOU YONG-TIAN;LI SSU-YI;HUANG KUO-TAI;LIANG MONG SONG 发明人 HSU PENG-FU;HOU YONG-TIAN;LI SSU-YI;HUANG KUO-TAI;LIANG MONG SONG
分类号 H01L27/092 主分类号 H01L27/092
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