发明名称 |
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE |
摘要 |
A manufacturing method of a semiconductor device is provided to reduce a gettering process time of a catalyst element added to a semiconductor film by performing a gettering process of the catalyst element. A bottom insulation film(11) is formed on an insulation surface of a glass substrate(10) which is transparent about a light. An amorphous semiconductor film(12) is formed on the bottom insulation film. A pulse light is irradiated on the amorphous semiconductor film in order to form a crystalline semiconductor film. The amorphous semiconductor film is crystallized. A light source maintains the most intensity of the light source for 1~5 seconds. The pulse light irradiation is performed with 2~20 times. |
申请公布号 |
KR20090098769(A) |
申请公布日期 |
2009.09.17 |
申请号 |
KR20090072680 |
申请日期 |
2009.08.07 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
YAMAZAKI SHUNPEI;TAKANO TAMAE;DAIRIKI KOJI |
分类号 |
H01L21/26;H01L29/786;H01L21/20 |
主分类号 |
H01L21/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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