| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the reliability of wire connection including down bonding, and to prevent peeling-off between a tab to which a semiconductor element is fixed and resin which constitutes a package. <P>SOLUTION: A non-leaded type semiconductor device comprises a tab, tab suspension leads, and a plurality of other leads exposed to one surface of a seal member, a semiconductor element positioned within the seal member and fixed to a surface of the tab with an adhesive, electrically conductive wires for electrically connecting electrodes on the semiconductor element and the leads, and electrically conductive wires for electrically connecting electrodes on the semiconductor element and a tab surface deviated from the semiconductor element. The tab is larger than the semiconductor element so that outer peripheral edges of the tab can be positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between a semiconductor element fixing area to which the semiconductor element is fixed and a wire connection area to which the wires are connected, surrounding the semiconductor element fixing area. The tab has a section, which is in the shape of an inverted trapezoid, and the peripheral edges of the tab bite into a package. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
