| 摘要 |
A flux for soldering of the present invention, in connecting a mounting pad exposed on a board to a solder ball, is applied onto at least one of a surface of the mounting pad and the solder ball. The flux for soldering contains a solvent, and the solvent contains a compound, which is represented by a general formula (1) and having a boiling point of 218° C. or higher and 240° C. or lower: R1-R2n-OH . . . (1).
|
