| 摘要 |
<p>Disclosed is a radiation-sensitive resin composition that, even when a novolak resin is used, is less likely to evolve an outgas from a resin film after heat firing. Also disclosed is an organic electroluminescent element comprising an insulating film formed by radiation lithography using the composition. The radiation-sensitive resin composition comprises (A) a novolak resin comprising repeating units having a structure in which at least a methyl group, a phenyl group, or a hydroxyphenyl group has been bonded instead of hydrogen atoms in methylene groups which bond phenols to each other, (B) at least one heat-reactive compound selected from the group consisting of benzoxazine compounds, carbodiimide compounds, triazine thiol compounds, and bismaleimide compounds, and (C) a radiation-sensitive compound.</p> |
