| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent migration. <P>SOLUTION: A semiconductor module comprises a semiconductor chip 10 where an integrated circuit 12 is formed, a plurality of electrodes 14 electrically connected to the integrated circuit 12, an insulating film 16 having a plurality of openings positioned above the plurality of electrodes 14 and formed on the semiconductor chip 10, and a long elastic projection 18 disposed on the insulating film 16. The plurality of wiring lines 20 extend from on the plurality of electrodes 14 across an axis AX along the direction wherein the elastic projection 18 extends to reach a top of the elastic projection 18. A plurality of leads 26 come into contact with parts of the plurality of wiring lines 20 on the elastic projection 18 respectively. An interval between a surface of the semiconductor chip 10 where the elastic projection 18 is formed and a surface of an elastic substrate 24 where the plurality of leads 26 are formed is held by a cured adhesive 22. Parts between the elastic projection 18 and adjacent wiring lines 20, and the elastic substrate 24 come into contact with each other with elastic force. <P>COPYRIGHT: (C)2009,JPO&INPIT |
