发明名称 BOARD AND MANUFACTURING METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a component incorporated board in which an electronic component such as a semiconductor element is incorporated, the component incorporated board being high in reliability such that the incorporated electronic component is not damaged and an excellent electric connection between the electronic component and an internal-layer circuit electrode of the board is made, and a manufacturing method for the same. <P>SOLUTION: The board 10 including the electronic component 2 includes an intermediate layer 3 that includes resin containing carbon fibers that surrounds the electronic component 2 arranged on a core board 1. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009212146(A) 申请公布日期 2009.09.17
申请号 JP20080050955 申请日期 2008.02.29
申请人 FUJITSU LTD 发明人 TANI MOTOAKI
分类号 H05K3/46 主分类号 H05K3/46
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