| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave device, capable of being made as small as its elements and also to provide its mounting structure body. <P>SOLUTION: This surface acoustic wave device S1 comprises: a surface acoustic wave element 3 which has an excitation electrode 1 and lead electrodes 8, 9 electrically connected to the electrode 1 on its undersurface; a base substrate 14, which is disposed opposite to the surface acoustic wave element 3, with a space therebetween and connected to the surface acoustic wave element 3 on the outside of its sealed space in plane perspective view; and lead members 18 for connecting the inside electrode to the outside circuit whose upper portions are electrically connected to the lead electrodes 8, 9, respectively, wherein the base substrate 14 has pass-through holes 15 at connection positions between the lead members 18 and the lead electrodes 8, 9, respectively, and the lower portion of each lead member 18 is led out to a position lower than that of the sealed space via a pass-through hole 15. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
