| 摘要 |
PROBLEM TO BE SOLVED: To downsize a piezoelectric device in which a piezoelectric resonating element and an IC chip are overlapped. SOLUTION: A piezoelectric device includes a quartz crystal resonating element 30, an IC chip 20 and a package 10 which mounts the quartz crystal resonating element 30 and the IC chip 20 on a base part 11 and houses it inside. Regarding the package 10, a side of one principal surface 21 of the IC chip 20 is mounted on the base 11, a height L1 from a bottom face 11a of the base part 11 to a mount face 15a1, 15b1 of the quartz crystal resonating element 30 is formed lower than a height L2 from the bottom face 11a to another principal surface 22 of the IC chip 20, the quartz crystal resonating element 30 is disposed so as to be overlapped with the IC chip 20 in a planar view, and one end portion 37 of the quartz crystal resonating element 30 is mounted on the mount face 15a1, 15b1 while tilting a portion, overlapped with the IC chip 20, of the quartz crystal resonating element 30 is away from the other principal surface 22 of the IC chip 20 as goes from the side of the one end portion 37 of the quartz crystal resonating element 30 to the side of another end portion 38. COPYRIGHT: (C)2009,JPO&INPIT
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