发明名称 PLASMA PROCESSING APPARATUS
摘要 <p>Provided is a plasma processing apparatus wherein a processing chamber can be efficiently maintained. Specifically, a plasma processing apparatus (1) is provided with a processing chamber (11) having a lower chamber (12) and an upper chamber (13); a base (20) whereupon a silicon substrate (K) is to be placed; a processing gas supply apparatus (27); a coil (31); a high frequency power supply (33) for the coil; a lifting plate (41) which has a through hole (41a) and is arranged to be freely brought up and down; a lifting mechanism (42) which holds and brings up and down the lifting plate (41); and a fixing mechanism (46) for fixing the upper chamber (13). The fixing mechanism (46) is composed of a fixing plate (47); first fixing bolts (48, 49) for connecting and fixing a top plate (16) and the lifting plate (41) to each other by means of the fixing plate (47); a second fixing bolt (50) for fixing a flange section (32b) of the holding member (32) and an annular plate (14) to each other, and a third fixing bolt (51) for fixing the annular plate (14) and a side wall (12a) of the lower chamber (12) to each other.</p>
申请公布号 WO2009113213(A1) 申请公布日期 2009.09.17
申请号 WO2008JP71960 申请日期 2008.12.03
申请人 HAYAMI, TOSHIHIRO;SUMITOMO PRECISION PRODUCTS CO., LTD.;HAYASHI, YASUYUKI 发明人 HAYAMI, TOSHIHIRO;HAYASHI, YASUYUKI
分类号 H01L21/3065;H01L21/31 主分类号 H01L21/3065
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