SUBSTRATE LAMINATING APPARATUS AND LAMINATEING METHOD USING THE SAME

摘要

A substrate laminating apparatus and a laminating method using the same are provided to remove bubbles from glue through which first and second substrates are bonded by lowering a vacuum degree below a certain pressure. A substrate laminating device(1000) includes a chamber(100), a substrate holder(200), a pressing roller device(400), a transfer device(500) and a gap maintaining device(600). The inner temperature of the chamber is adjusted, and the substrate holder is installed in the chamber, and has a mounting unit(210) at which a first substrate is mounted. A compression roller device is installed in the inside of the chamber, and compresses a second substrate bonded with the first substrate at a certain pressure. The transfer device transfers the compression roller device, and the gap maintaining device uniformly maintains the interval between the first and second substrates.