| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus in which wiring inductance is reduced and a special capacitor with high heat resistance is not necessary as the capacitor. <P>SOLUTION: A plurality of semiconductor chips 23 are mounted on a ceramic substrate 21 constituting a substrate 22. A plate-like positive electrode-wiring member 27 and a plate-like negative electrode-wiring member 28 are bonded to circuit patterns 24b and 24c of the substrate 22 by ultrasonic junction in a terminal part, so that they are closely overlapped in a state where they become parallel to the substrate 22 and they are mutually insulated. A plurality of capacitors 17 are arranged on the negative electrode-wiring member 28 in a state where a positive electrode terminal and a negative electrode terminal are electrically connected to the positive electrode-wiring member 27 and the negative electrode-wiring member 28, respectively. Bonding parts 27b and 28b of the terminal part disposed on the same side of the wiring members 27 and 28 are disposed to position on a straight line. <P>COPYRIGHT: (C)2009,JPO&INPIT |
