| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve reliability in electric connection. <P>SOLUTION: A semiconductor module includes: a semiconductor chip 10 in which an integrated circuit 12 is formed; a plurality of electrodes 14 electrically connected to the integrated circuit 12; a plurality of bumps 18 electrically connected to the plurality of electrodes 14 each; a plurality of leads 26 coming into contact with the plurality of bumps 18 each; and a base substrate 24 in which the plurality of leads 26 are formed. An adhesive 28 is cured and holds spacing between a surface on which the bump 18 of the semiconductor chip 10 is formed and that on which the plurality of leads 26 of the base substrate 24 are formed. In the semiconductor chip 10, stress in a shrinking direction remains. In the plurality of leads 26, press is applied in the central direction of the semiconductor chip 10 via the plurality of bumps 18 at least from the semiconductor chip 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
