| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device which makes the apparatus simple in configuration and low in cost. SOLUTION: In a step of bringing bumps closer to other bumps or to an electrode to bond both bumps or the bumps and electrode together, especially in a step of bonding by thermal solder fusion, the position of the approaching side is monitored to examine a state of junction. COPYRIGHT: (C)2009,JPO&INPIT
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