发明名称 MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus simplifying a structure, reducing the number of components, easily carrying out manufacturing and installation work and reducing cost. SOLUTION: An upper die holder 43 is relatively movably mounted to an elevating/lowering body 41 in a vertical direction in a range of a predetermined gap G by a relative movement mechanism 44. Upper ends of weir members 54 are coupled with the elevating/lowering body 41 corresponding to gates 52 for supplying a melt Y from a reservoir chamber 34 arranged at a lower die unit 21 to cavities K. The lower die unit 21 and an upper die unit 22 are lowered in a state that the upper die unit 22 is clamped to the lower die unit 21, and the melt Y in the reservoir chamber 34 is supplied to the cavities K by allowing a pressing rod 33 to enter the reservoir chamber 34. During supplying the melt the lower surface of the elevating/lowering body 41 is made to contact with the upper die holder 43 to eliminate the gap G, and the lower ends of the weir members 54 are made to enter the inside of the gates 52 to reduce the passage cross section of the gates 52. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009208091(A) 申请公布日期 2009.09.17
申请号 JP20080051133 申请日期 2008.02.29
申请人 KIMURA KOGYO:KK 发明人 SAWADA KIYOSHI
分类号 B22D17/22;B22D18/02;B29C45/30 主分类号 B22D17/22
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