发明名称 PLATED COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To make effort at a composition of a coated surface of a member consisting essentially of copper to prevent the development of whisker and to structure a high reliable terminal component or the like for a flexible wiring connection. SOLUTION: The terminal component is provided with a terminal base material 1 consisting essentially of copper and a Sn-Ag-Cu alloy plated coating film 3 electroplated on the terminal base material 1 and having 3-7 wt.% concentration of a Ag composition, 0.3-0.7 wt.% concentration of Cu composition and remaining Sn composition. The plated coating film 3 has Ag or a compound consisting essentially of Ag deposited on the surface of the plated coating film 3 by a prescribed heat treatment. In the structure, Ag or the compound consisting essentially Ag deposited on the surface of a FPC connector terminal 10 occupies≥2% of total surface area of the FPC connector terminal 10. Then, the development of the whisker is prevented by allowing Ag or the compound consisting essentially of Ag to function as a barrier. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009209402(A) 申请公布日期 2009.09.17
申请号 JP20080052507 申请日期 2008.03.03
申请人 SONY CORP 发明人 ASAI TADASHI
分类号 C25D5/50;C25D7/00 主分类号 C25D5/50
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