发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ETCHED RING AND DIE PADDLE AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system is provided including: forming a D-ring includes half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.
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申请公布号 |
US2009230529(A1) |
申请公布日期 |
2009.09.17 |
申请号 |
US20090473239 |
申请日期 |
2009.05.27 |
申请人 |
DIMAANO JR ANTONIO B;SHIM IL KWON;MAGNO SHEILA RIMA C |
发明人 |
DIMAANO, JR. ANTONIO B.;SHIM IL KWON;MAGNO SHEILA RIMA C. |
分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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