A wafer processing tape is provided to progress a wafer sawing process smoothly by positioning adhesive layers having different adhesive force on a base film in which a wafer and a wafer ring are mounted. An adhesive layer is formed on the upper side of a base film(60). The first adhesive domain is formed at the location in which a wafer is mounted on the base film. The second adhesive domain is formed at the location in which a wafer ring is mounted on the base film. A lower adhesive layer(62) and an upper adhesive layer(64) are successively laminated, so the adhesive layer is formed. The upper adhesive layer is laminated on the central part of the lower adhesive layer with exposing the edge of the lower adhesive layer. The wafer ring is mounted on the upper side of the edge of the exposed lower adhesive layer.
